1 Introduction to Read/Write Electronics Upgrade Modules

Contents of this section

1.1 Summary of changes since the previous version of this document

Major changes since the March 1995 release of version 1.4 of this document include:

  1. Improved mechanical construction of the head assembly module featuring a septum divider with shield cover (HAM and SDP).
  2. Improved head preamplifier board design which is easier to manufacture; the new septum divider design is required to accommodate new HPBs.
  3. Grounding instructions for head assembly cables have changed, please see section wrmham .
  4. Read board RDB design has now additional balancing biasing resistors for TL592 amplifiers to increase saturation margin by reducing differential d.c.~input voltage, as suggested by Dan Smythe (Haystack).
  5. Automated testing procedures are now based on NASA FS 9.1.x instead of DARFS VLBA DAR control software. (See section autotest .)

1.2 R/W Upgrade Features

This upgrade package provides your Mark~IIIA tape recorder with increased recording capacity required by the new VLBA and Mark~IV VLBI recording formats. It consists of the following:

The head assembly module replaces the old read and write interface boxes (behind the tape recorder reel panel) with new head interface and preamplifier boards fitted onto a new ``septum divider.'' The two headstacks of Mark~IIIA are reused and placed side-by-side in the upper head block position.

Read and write modules complement the head assembly to form a complete set of R/W electronics. A power distributor module is required to create supply voltages for these modules from the existing supply voltages. I/O board has to be swapped because the old one cannot control new read/write modules.

Some reasons for upgrading R/W electronics:

All of these shortcomings are remedied in the upgraded electronics:

Note that the new I/O board does not support selection of enabled write tracks. This is handled by the new Mark~IV formatter. Similarly, please note that reading from tape at 16~Mbits/s is not supported by the Haystack design.

A Mark~IV tape recorder upgraded in this way can record at the maximum rate of 1~Gbits/s (=2~heads x 32~tracks x 16~MBits/s). It can be further upgraded to accommodate four headstacks. This ``full upgrade'' requires:

The resulting ``full Mark~IV'' tape recorder is capable of recording at 2~Gbits/s.

The Metsähovi delivery consists of the following submodules, easily identified by their three-letter abbreviations. These abbreviations are present on the serial number labels fitted on the modules.

  1. RDM - Read Interface Module
  2. WRM - Write Driver Module (2 modules)
  3. PWM - Power Distribution Module
  4. IOM - Input/Output Module
  5. HAM - Head Assembly Module
  6. SPK - Spare Parts Kit

Each module is supplied with the cables required to connect it to the rest of the system. These cables are described in individual module descriptions.

In figure all-modules.eps you can see the modules and cables that constitute the upgrade. (Note that the spare parts kit is not illustrated. The module photographs appear with courtesy of Seppo Urpo.)

Figure file all-modules.eps.ps: All upgrade modules.

1.3 Overview of R/W upgrade

For an overview of the module interconnections, please see the block diagram in figure block.eps . Boldfaced rectangles depict modules that are part of this upgrade. Dashed rectangles represent modules that can be added later for the ``full'' recorder upgrade.

Figure file block.eps.ps: Block diagram of the upgrade.

Throughout this document and in the drawings, track numbers are referenced using the ``VLBA/MkIV'' track numbering. The 36 tracks available in a Metrum-style narrow-track headstack receive the numbers 0--35. So, the ``traditional'' Mark~IIIA track number 1 is track 4 in the new numbering scheme.

Please also note that as a consequence of this numbering change, the conventional Mark~IIIA ``even'' tracks are now found at connectors labeled ``odd'' and vice versa.

Write signal path

As you can see in figure block.eps , the write signals originate at the formatter. For WRM~1 (and for WRM~3 whenever it is installed) the write signals go through the IOB where they are subject to simply remapping of connector pins. For WRM~2 (and for WRM~4) the signals go directly from the formatter to the WRM input connectors at their front panels. For each write module, a pair of 40-way twisted-pair ribbon cables is used, one cable delivering the differential signals of either even or odd tracks.

The write modules condition the signal as described in WRM description in section wrm . The output cables are connected at the rear panel of WRMs---these cables are part of the head assembly (HAM) and its connector plate module (CPM) described in section cpm .

From the connector plate the write signals travel to head interface boards (HIBs) which are mounted at the head assembly itself. HIBs connect directly to the headstacks and perform final conditioning to the signal before it is written onto tape.

The bypass monitoring signals ``A'' and ``B'' are selected inside each WRM and diverted to the IOM and from there to the Mark~III decoder. Any two of the 36 available headstack tracks can be selected: the selection signals originate at IOB (controlled by field system computer via MAT) and both the selection signals and the returned bypass signals are transmitted in the same 40-way grey ribbon cable that connects to the front panel of each WRM.

Read signal path

The signals from tape are first amplified at HIBs and the second amplification stage is on the head preamplifier boards (HPB) that are connected with short wires to the HIBs. A third stage buffers the output of HPB. Amplified output of HPBs is connected via the CPM to the input connectors at the rear panel of the read module (RDM). The RDM selects two tracks out of the 36 available ones for further amplification and equalizer conditioning. The conditioned signals are fed to the IOB where the inherent signal clock is recovered with clock synchronization chips and the resulting signals are presented to the existing Mark~III decoder.

1.4 Installing the upgrade

Intrinsically, installing the upgrade is a simple matter: you just replace all electronics in the current signal path from formatter to write headstack and from read headstack to decoder. The headstacks themselves and their adjustments are not touched.

In practice you need to remove first:

Then you can install the following:

A Haystack reference drawing ``4712K003'' of the installation is provided in the documentation binder section ``Installation Instructions.''

For complete step-by-step installation instructions, please see the separate document ``Installing Mark~IV Read/Write Electronics Upgrade'' that is provided in the section ``Installation Instructions'' of the documentation binder.

1.5 Test procedures

This section presents strategies to system-level testing of the modules. Module-level test procedures are described in the installation manual and its checkout procedure section.

Automated procedures used at Metsähovi

Two automated SNAP procedures were developed for testing RDM and WRM modules. The procedures can be found in file ``mdextr.prc'' which has been printed out together with test log reports in the station-specific information section of the documentation binder.

Since these tests were conducted with Metsähovi VLBA DAR, the procedures make use of the VLBA formatter capability to embed track numbers in the auxiliary data field of each formatter frame. They also expect to find SNAP commands for manipulating VLBA features of the VLBA formatter, and this is provided in the NASA FS~9.1.0 and later.

The log files produced by applying these procedures to those particular RDMs and WRMs that have been delivered to a given station are available in the station-specific section of the documentation binder.

The procedure ``testwrm'' exercises the write signal paths by checking the bypass reproduce signal of each track. (This signal is not present unless WRM is driving a HAM, so the WRM was connected to Metsähovi MkIV/VLBA HAM.) The decoded track numbers must match the expected track numbers and the data quality analyzer must show zero parity errors.

The procedure ``testrdm'' relies on reading a test tape written with all 36 VLBA tracks enabled. Again, the decoded track numbers must match the expected track numbers. Please see the printouts of running these procedures on your hardware, included in the station-specific section of this documentation binder.

Suggested manual procedures

With the new Mark~IV formatter it should be possible to write a blank tape with one track enabled for a short period, say 200~feet. All tracks of the write head would be written in succession on the tape, only one track enabled at a time. Then the tape would be played back and the decoder used to if a given track is the only track decoding properly for a given 200 feet tape segment.

The process should be repeated (always on a blank tape) with 4~Mbits/s and 135~ips and 8~Mbits/s and 270~ips. Recording at 16~Mbits/s with 320~ips can be played back at 160~ips and verified in the same way as 8~Mbits/s. Neither the Mark~IV RDM nor the existing Mark~III decoder were designed for direct 16~Mbits/s playback.

This procedure can be written in SNAP schedules when the formatter control language can be tested in practice.

1.6 Online information

Manufacturing documentation files are available online at ftp://kurp-ftp.hut.fi/pub/mk4 . This directory has the following structure:

pub/mk4/pwm/pwb
pub/mk4/pwm/php
pub/mk4/rdm/rdb
pub/mk4/wrm/wrb
pub/mk4/iom/io-board
pub/mk4/ham/hpb

Each of the subdirectories ``pwb'', ``rdb'', and ``wrb'' contain a similar set of files, namely (for a directory ``xxb''):

The rest of the files are board fabrication output. Each of the following outputs are provided with ``.ps'' (PostScript), ``.pho'' (Gerber output), and ``.rep'' (Gerber aperture definitions) files. Drilling information is in the files:

The contents of subdirectories ``pub/mk4/pwm/php'', ``pub/mk4/iom/io-board'', and ``pub/mk4/ham/hpb'' are presented in their corresponding subsections later in this document.

All these files should be transferred in binary mode. The text files already have CRLF line endings suitable for DOS PCs.

Please note that many of the original Haystack AutoCAD and FutureNet document files are available at ftp://card.haystack.edu/pub/mark4/4712 .

1.7 Contacting Metsähovi

The fastest way to contact Metsähovi to get assistance with Mark~IV read/write electronics is to send email to:

vlbi@hut.fi

You can also reach us using the following fax number:

+358-0-264531

Our address is:

Metsähovi Radio Research Station

Mark~IV R/W

Metsähovintie 114

FIN-02540 KYLMÄLÄ

FINLAND

Please do not hesitate to contact us if you have questions about the upgrade. We can help you for instance in getting accessories for additional upgrades:

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